I use John's method. Use a sharp pointed tip and try to keep it on the component lead. The traces on the R2LC do lift easily. I have used braid also but only when suction fails to remove all the excess solder. Gary is right though about using too much pressure with braid. That will surely lift the trace.
If possible cut the leads off the component before trying to unsolder them. That allows removal one lead at a time vs trying to melt three leads on a triac or other component while pulling.
Pete
